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8pF ESD Protection Array
Silicon Protection Arrays
TM
RoHS
Pb
GREEN
SP1001 Lead-Free/Green Series
Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, 8KV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins.
Pinout
SP1001-02 (SC70-3)
1 1
Features
SP1001-04 (SC70-5)
5 1
SP1001-05 (SC70-6)
6
(TYP) per I/O contact discharge, 15kV air discharge, (Level 4, IEC61000-4-2) IEC61000-4-4, 40A (5/50 ns)
0.5A (MAX) at 5V board space IEC61000-4-5, 2.5A (8/s)
3
2
2
5
2
3
4
3
4
SP1001-02 (SOT 553)
NC 5 1
SP1001-04 (SOT 553)
5 1
SP1001-05 (SOT 563)
6
2
2
2
5
NC
4
3
4
3
4
Functional Block Diagram
SP1001-02
1 2 5
Applications
SP1001-02
4
3
2
SP1001-04
5 4
SP1001-05
6 5 4
1
2
3
1
2
3
(c)2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
11
SP1001 Lead-Free/Green Series
Lead-Free/Green SP1001
Silicon Protection Arrays
TM
8pF ESD Protection Array
Absolute Maximum Ratings
Symbol IP TOP TSTOR Peak Current (tp=8/20s) Operating Temperature Storage Temperature Parameter Value 2 -40 to 85 -60 to 150 Units A C C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 300 Units C C C
Electrical Characteristics (TOP = 25C)
Parameter Forward Voltage Drop Reverse Voltage Drop Reverse Standoff Reverse Leakage Current Clamp Voltage1 Symbol VF VR VRWM ILEAK VC Test Conditions IF=10mA IR=10mA IR1A VR=5V IPP=1A, tp=8/20s, Fwd IPP=2A, tp=8/20s, Fwd IEC61000-4-2 (Contact) IEC61000-4-2 (Air) Reverse Bias=0V Diode Capacitance1 CD Reverse Bias=2.5V Reverse Bias=5V
Notes:
1 2
Min 0.7 6.0
Typ 0.9 6.7
Max 1.2 8.0 5.5 0.5
Units V V V A V V kV kV
8.0 9.7 8 15 12 8 7
11.0 13.0
ESD Withstand Voltage1,2
VESD
pF pF pF
Parameter is guaranteed by device characterization A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode
Capacitance vs. Reverse Bias
14
12
10
Capacitance (pF)
8
6
4
2
0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
DC Bias (V)
SP1001 Lead-Free/Green Series
12
(c)2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
8pF ESD Protection Array
Silicon Protection Arrays
TM
Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors Application Example directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground.
Input
LCD module Controller
D1 D2 D3 D4
Outside World
SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553)
Shield Ground
Signal Ground
Soldering Parameters
Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb - Free assembly 150C 200C 60 - 180 secs 3C/second max 3C/second max 217C 60 - 150 seconds 250+0/-5 C 20 - 40 seconds 6C/second max 8 minutes max. 260C
Peak Temperature (TP) Time within 5C of actual peak Temperature (tp) Ramp-down Rate Time 25C to peak Temperature (TP) Do not exceed
(c)2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
13
SP1001 Lead-Free/Green Series
Lead-Free/Green SP1001
Silicon Protection Arrays
TM
8pF ESD Protection Array
Part Numbering System
Product Characteristics
Lead Plating
G= Green T= Tape & Reel Package
J = SC70-3, -5 or -6, 3000 qty X = SOT553 or SOT563, 5000 qty
SP1001-02 J T G
Silicon Protection Array Series Number of Channels
02 = 2 Channel 04 = 4 Channel 05 = 5 Channel
Matte Tin Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0
Lead Material Lead Coplanarity Subsitute Material Body Material Flammability
Part Marking System
Notes : 1. All dimensions are in millimeters
AXX AXX
Product Series
A = SP1001 series (varies)
2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr.
Number of Channels
(varies)
4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13.
Assembly Site
Ordering Information
Part Number SP1001-02JTG SP1001-02XTG SP1001-04JTG SP1001-04XTG SP1001-05JTG SP1001-05XTG Package SC70-3 SOT553 SC70-5 SOT553 SC70-6 SOT563 Marking AX2 AX2 AX4 AX4 AX5 AX5 Min. Order Qty. 3000 5000 3000 5000 3000 5000
Package Dimensions - SC70-3
B 3 E HE 1 e e 2
Solder Pad Layout
Package Pins JEDEC Min A A1 A2 B c D E e HE L 0.80 0.00 0.70 0.15 0.08 1.85 1.15 0.66 BSC 2.00 0.26 2.40 0.46 Millimeters Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35
SC70-3 3 MO-203 Issue A Inches Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018
D A2 A
A1
0.026 BSC
C L
SP1001 Lead-Free/Green Series
14
(c)2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
8pF ESD Protection Array
Silicon Protection Arrays
TM
Package Dimensions - SC70-5
Package
e 6 5 e 4
SC70-5 5 MO-203 Issue A Millimeters Min Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 0.65 BSC 2.00 0.26 2.40 0.46 Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Inches Max 0.043 0.004 0.039 0.012 0.010 0.089 0.053 0.094 0.018
Pins Solder Pad Layout
E HE
not used
JEDEC
1 B
2
3
A A1 A2 B
A2 A
0.80 0.00 0.70 0.15 0.08 1.85 1.15
D
c D E e HE
L
A1 C
0.026 BSC
L
Package Dimensions - SC70-6
B 6 5 B 4
Package Solder Pad Layout
E HE
SC70-6 6 MO-203 Issue A Millimeters Min Max 1.10 0.10 1.00 0.30 0.25 2.25 1.35 0.65 BSC 2.00 0.26 2.40 0.46 Min 0.031 0.000 0.028 0.006 0.003 0.073 0.045 0.079 0.010 Inches Max 0.043 0.004 0.039 0.010 0.089 0.053 0.094 0.018
Pins JEDEC
1 B
2
3
A A1
D A2 A
0.80 0.00 0.70 0.15 0.08 1.85 1.15
A2 B c
A1
D E e
L
C
0.026 BSC
HE L
Package Dimensions - SOT553
A D 6 5 4 E 3 c B HE L
Package Pins Millimeters Solder Pad Layout A B c D E e L HE 0.10 1.50 Min 0.50 0.17 0.08 1.50 1.10 0.50 BSC 0.30 1.70 Max 0.60 0.27
SOT 553 5 Inches Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067
(not used)
2 e
0.018 1.70 1.30
0.014 BSC
(c)2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
15
SP1001 Lead-Free/Green Series
Lead-Free/Green SP1001
0.012
Silicon Protection Arrays
TM
8pF ESD Protection Array
Package Dimensions - SOT563
D 6 5 2 e B 4 E 3 HE A L
Package Pins Solder Pad Layout A B Millimeters Min 0.50 0.17 0.08 1.50 1.10 0.50 BSC 0.10 1.50 0.30 1.70 Max 0.60 0.27 0.18 1.70 1.30
SOT 563 6 Inches Min 0.020 0.007 0.003 0.059 0.043 0.004 0.059 Max 0.024 0.011 0.007 0.067 0.051 0.012 0.067
c
c D E e L HE
0.020 BSC
Embossed Carrier Tape & Reel Specification - SC70-3 Dimensions
Millimetres Min E F P2 D D1 P0 10P0 W P A0 A1 B0 B1 K0 K1 t 1.10 0.60 Ref 0.27 max 2.30 1.90 Ref 1.30 0.043 0.010 1.65 3.45 1.95 1.40 1.00 3.90 7 .70 3.90 2.30 1.00 Ref 2.50 Max 1.85 3.55 2.05 1.60 1.25 4.10 8.10 4.10 2.50 Min 0.065 0.135 0.077 0.055 0.039 0.154 0.303 0.153 0.090 0.090 0.074 0.051 0.023 Ref Inches Max 0.073 0.139 0.081 0.063 0.049 0.161 0.318 0.161 0.098 0.098
40.0 +/- 0.20
1.574 +/- 0.008
0.039 Ref
SP1001 Lead-Free/Green Series
16
(c)2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
8pF ESD Protection Array
Silicon Protection Arrays
TM
Embossed Carrier Tape & Reel Specification - SC70-5 and SC70-6 Dimensions
Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 1.65 3.45 1.95 1.40 1.00 3.90 7 .70 3.90 2.14 2.24 1.12 0.27 max Max 1.85 3.55 2.05 1.60 1.25 4.10 8.10 4.10 2.34 2.44 1.32 Min 0.065 0.135 0.077 0.055 0.039 0.154 0.303 0.153 0.084 0.088 0.044 Inches Max 0.073 0.139 0.081 0.063 0.049 0.161 0.318 0.161 0.092 0.096 0.051
40.0 +/- 0.20
1.574 +/- 0.008
0.010 max
Embossed Carrier Tape & Reel Specification - SOT553 and SOT563 Dimensions
Millimetres Min E F P2 D D1 P0 10P0 W P A0 B0 K0 t 1.65 3.45 1.95 1.40 0.45 3.90 7 .70 3.90 1.73 1.73 0.64 0.22 max Max 1.85 3.55 2.05 1.60 0.55 4.1 8.10 4.10 1.83 1.83 0.74 Min 0.065 0.135 0.077 0.055 0.017 0.154 0.303 0.153 0.068 0.068 0.025 Inches Max 0.073 0.139 0.081 0.063 0.021 0.161 0.318 0.161 0.072 0.072 0.029
40.0 +/- 0.20
1.574 +/- 0.008
0.010 max
(c)2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.
17
SP1001 Lead-Free/Green Series
Lead-Free/Green SP1001

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